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Shenzhen danbang Technology Co., Ltd. (listed on the small and medium-sized board of Shenzhen Stock Exchange, stock code: 002618) was founded in 2001 with a registered capital of RMB 365.28 million. It is a national high-tech enterprise specializing in the research and development and production of flexible circuits and materials, an industrialization base of the achievements of the national high-tech research and development plan, and a R & D center of flexible circuits and materials, It is China's largest flexible material to flexible packaging substrate to flexible chip device packaging products, and a service provider in the industrial chain of design, manufacturing and service. The company has a number of independent intellectual property rights, with core technologies in the industrial chain from flexible materials to flexible packaging substrates to chip packaging components, and provides customers with complete flexible interconnection and packaging solutions for design, manufacturing and service. The company's main products include flexible FCCL, high-density FPC, chip packaging COF substrate, chip and device packaging products and flexible packaging related functions heat curing adhesive, micro adhesive film, etc., which are mainly used in small space, mobile and folding high-end intelligent terminal products, and in all microelectronics leaders in consumer electronics, medical devices, special computers, intelligent display, high-end equipment industry, etc Domains are widely used. Danbang science and technology will continue to adapt to the changing trend of the times, as always committed to the development of new products and technologies, to achieve high-quality products to serve domestic and foreign markets, protect the environment, care about people's livelihood and serve the society, and continue to expand its contribution to the society.

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