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Jingfeng electronic packaging materials (Wuhan) Co., Ltd. (hereinafter referred to as "Jingfeng materials") is a high-tech enterprise that develops, produces and sells integrated circuit packaging materials (mainly used for semiconductor packaging materials), bonding materials for display screen and touch screen, smart card packaging materials and provides relevant technical consulting services. It is founded by senior research scientists from the United States. Founded in 2007, the company combines the technology of electronic packaging materials with the rapid development of electronic packaging industry in China to provide packaging materials with high performance, high quality and low price. After nearly years of efforts, the initial investment is basically in place. At present, the company has established a complete set of reasonable, scientific and perfect quality management system, completed the investment of all production equipment and inspection equipment, and gradually introduced and cultivated a group of professional management talents, marketing talents, scientific research and innovation talents and innovation teams who have a good understanding of the industry, market and operation mode, and master the management concept of modern enterprises. In the process of development, EPM has been cooperating with a number of domestic scientific research institutions and institutions of higher learning, including Institute of microelectronics, Chinese Academy of Sciences, Wuhan University, Huazhong University of science and technology and other institutions, so as to rapidly improve the ability of product design and development, production process improvement and customer service.

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