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Started in 1972, Changdian technology, a high-tech enterprise, was founded in 1972 and successfully listed on the main board of Shanghai Stock Exchange in 2003. After more than 40 years of development, Changdian technology has become a world-famous integrated circuit packaging and testing enterprise. Changdian technology provides a full set of professional production services for packaging design, product development and certification, as well as from in chip testing, packaging to finished product testing and shipping. Changdian technology is committed to the sustainable development strategy, upholds the concept of harmonious development and win-win cooperation among employees, enterprises, customers, shareholders and society. It has been rated as a national key high-tech enterprise, director unit of IC packaging technology innovation strategic alliance, China's export product quality demonstration enterprise, etc., and has a National high-density IC Engineering Laboratory and enterprise Technical center, postdoctoral research station, etc. The production, R & D and sales network of Changdian technology has covered the world's major semiconductor markets. Changdian technology has a wide range of technology accumulation and product solutions, including fan outewlb, WLCSP, bump, pop, FCBGA, sip, PA and other packaging technologies with independent intellectual property rights. In addition, lead frame packaging and independent brand discrete devices are also praised by customers. With the values of "respect, tolerance, progress and truth-seeking", Changdian technology shapes its employees, promotes the harmonious family culture of "one enterprise, one team and one dream", and makes every effort to satisfy customers with the service concept of "not seeking uniqueness, striving to be the first". Changdian technology - make better changes in the future!

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